Key Responsibilities & Skills:Tools & Knowledge:Mentor/Siemens and Cadence tools (especially for Package Layout Automation - PLA).Technical Expertise:Multi-layer package design experience.Understanding of substrate manufacturing Design Rules and Assembly Rules.Familiarity with SIPI (Signal Integrity & Power Integrity) Rules.Flip-chip package design concepts.Tasks:Perform point-to-point connections.Run DRC (Design Rule Checks), identify root causes, and fix issues.Execute design based on provided schematics, including component placement and constraint setup.