About the RoleA deep-tech startup in the photonics industry is pioneering the next generation of solid-state far-UVC light sources, enabling compact, energy-efficient devices for disinfection, sensing, and advanced photonic applications.The organization is seeking an experienced Lead Photonic Product / Packaging Design Engineer to play a critical role in developing next-generation far-UVC light engines. This full-time position will focus on the design and production release of photonic packages, requiring a hands-on engineer who can work across multiple disciplines and take ownership of complex design challenges.Key ResponsibilitiesLead product design and release for innovative packaged far-UVC light engines achieving industry-leading performance.Develop optoelectronic packaging solutions for hybrid and integrated photonic assemblies addressing thermal, electrical, optical, and material challenges.Interface between R&D and manufacturing partners to ensure Design for Manufacturing/Assembly (DfMA) and Design for Quality.Analyze product performance data and guide requirements for prototype, pilot, and production scaling.Coordinate assembly specifications and manage change controls for ramp-up to volume manufacturing.Own supply-chain resolutions, troubleshooting, and failure analysis during photonic product launch.Document inspection instructions, test criteria, and non-conformance actions to support manufacturing quality.Collaborate with cross-functional teams and partners to ensure packages meet performance and cost targets.Promote innovation, collaboration, and continuous improvement within the engineering organization.Qualifications & RequirementsMaster’s Degree in Electrical Engineering, Mechanical Engineering, Physics, Optics, Materials Science, or equivalent.6+ years of photonic or optoelectronic industry experience in new product development and product launch.Hands-on expertise in semiconductor laser diode packaging (e.g., 14-pin butterfly, TO-Cans, CoS).Experience managing photonic assembly vendors and coordinating with manufacturing teams.Skilled in statistical data analysis/visualization (e.g., JMP, R).Proficient in 3D CAD design tools (SolidWorks, AutoDesk Inventor).Strong understanding of thermal/mechanical constraints in laser packaging (heat transfer, stress, TEC).Knowledge of SPC, DfMA, FA, Root Cause Analysis, and Lean Manufacturing methods.Familiar with design constraints for on-chip photonic and electronic packaging (waveguides, wirebonds, vias, etc.).Excellent analytical, communication, and collaboration skills in multidisciplinary environments.Preferred SkillsPh.D. in Electrical Engineering, Mechanical Engineering, Physics, Optics, or Materials Science.Experience working with blue or UV-emitting laser diodes and III-Nitride-based devices.Experience transitioning products to foundries or contract manufacturers.Familiarity with semiconductor or wafer fabrication environments.Direct interaction experience with photonic customers.OpportunityThis is an opportunity to join a cutting-edge photonics team driving innovation in far-UVC technology, contributing to next-generation optical products that impact global health, safety, and sustainability.Key SkillsPhotonic, Optical